Visible LEDs

• Application Bulletin 228 - Thermal Management of Visible LEDs

Optoelectronic Components

• Application Bulletin 200 - Thermal behavior of GaAs LEDs
• Application Bulletin 205 - Gallium aluminum arsenide - a new generation of infrared LEDs superior to a gallium arsenide
• Application Bulletin 207 - Understanding infrared diode power ratings
• Application Bulletin 208 - A comparison of plastic versus metal packaging for infrared sensors and emitters
• Application Bulletin 210 - The successful design engineer has a clear understanding of the thermal impedance of the optical semiconductor
• Application Bulletin 213 - Application Circuits for the Phototransistor Switch
• Application Bulletin 215 - Maximizing power output using the OP232W
• Application Bulletin 222 - Converting radiant intensity in units of mW/cm2 to mW/sr
• Application Bulletin 237 - SMCC Microelectronic History and Handling Considerations
• Application Bulletin 240 - Photologic^®
• Application Bulletin 241 - Dual Photologic^®
• Application 248 - Basic Steps: Connecting and using Infrared Optoelectronics

Optoelectronic Assemblies

• Application Bulletin 201 - Motion Sensing with Optical Interrupters - Selecting the proper sensor for optimum system design
• Application Bulletin 203 - Two Channel Optical Interrupters may be used for determining direction of rotation, speed, and the relative location of a rotating shaft
• Application Bulletin 204 - Reflective Assemblies - Design considerations for single-sided sensing applications
• Application Bulletin 206 - Linear and rotary encoders are evolving to meet the demands of new system requirements, higher performance requirements, harsh environmental conditions and lower cost
• Application Bulletin 209 - Designing a "Wide-Gap Optical Switch" using an OP293/OP298 (plastic TO-46 equivalent) LED and OP593/OP598 (plastic TO-18 equivalent) phototransistor
• Application Bulletin 213 - Application Circuits for the Phototransistor Switch
• Application Bulletin 214 - Interfacing Sensors with a Microprocessor
• Application Bulletin 229 - Designing Encoder Elements for Two Channel Optical Interrupters
• Application Bulletin 247 - Reflective Assemblies: Design considerations for single-sided sensing applications.
• Application 249 - Slotted & Reflective Switches: Application Guidelines for the OPB Series (except surface mount versions)
  

Fiber Optic Devices

• Application Bulletin 220 - Fiber Optic LED Driver for TTL links up to 155 Mbps
• Application Bulletin 221 - Laser safety bulletin OPV Series, VCSEL

Vertical Cavity Laser

• Application Bulletin 223 - APV200 Series Reliability
• Application Bulletin 224 - OPV300 Series Reliability
• Application Bulletin 227 - Understanding VCSELs & LEDs in Sensing Applications
  

Hall Effect

• Application Bulletin 212 - Hall Effect Liquid Level Sensing
  

Miscellaneous

• Application Bulletin 202 - Soldering to Semiconductor Leads - a supplement to manufacturer's specifications
• Application Bulletin 211 - Recommendations for soldering T-1 3/4 plastic encapsulated discrete components
• Tape & Reel Specification Hi-Rel Surface Mount Products
• Application Bulletin 239 - LP Gas Low Fuel Warning Sensor
• Application Bulletin 246 - Thermal Transient Testing of LEDs
• Application Bulletin 237 - SMCC Microelectronic History and Handling Considerations