Autopad™ Technology is a non-contacting inductive approach to rotary, linear, and multi-axis position sensing.  Autopad™, by design offers improved accuracy, flexibility, and robustness when compared to existing sensor technologies.  Additionally, Autopad™ can usually offer a more cost effective solution for your system design.

An Autopad™ sensor is made up of three primary components.  A stationary printed circuit board we call the Pad is the first of these components.  The Pad is populated with electronic components, including an ASIC that drives the operation of the sensor.  The Pad “communicates” with a second printed circuit board called the Puck.  The Puck is allowed to move with the mechanical component whose relative position we are measuring.  The final component is the mechanical packaging containing the Pad and Puck.

As a complete sensor, Autopad™ generates an output signal with 12-bit accuracy over a full 360 degrees of rotation or across a defined linear distance. The Pad and Puck can take several geometric shapes to form linear, rotational or multi-axis sensors.

For more information on this technology please request a DVD.

Or please contact Ron Gooch at (248) 549-1438 or via email at rgooch@optekinc.com

OPTEK designs Autopad™ to fit your application.  Below are a few examples:

		Chassis Sensor
		Turbo Charger Sensor
		Seat Sensor
		PRNDL Sensor
		Transfer Case Sensor