Optoelectronic hybrids offer
solutions to many applications that cannot be satisfied with
standard or conventional
LED & VCSEL transmitters and photodiodes, phototransistors,
photodarlington or photologic® sensors.
These combine LED’s
and VCSEL’s with chip level, SMD and thick film components
to create systems that simplify the function of motion or surface
detection. The basic assembly process that OPTEK uses is Chip-On-Board.
This provides several advantages, such as:
- Size – OPTEK can achieve a size
reduction of up to 80%.
- Performance – we can offer creative
designs that cannot be fabricated with separately made
components (including some surface mount devices available
today).
- Packaging – We can offer unique
shapes and mounting configurations as well as material
combinations
to suit unique environmental conditions.
- Reliability – Hybrid assemblies allow
a significant reduction in part count. And the automated
processes coupled with OPTEK’s commitment to
quality results in robust, defect free products.
- Cost – Hybrid’s withstand
the challenges of low cost automated handling, placement
and
reflow soldering. Array processing further minimizes
cost and optimizes quality.
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